Cardlam™ CPF
Cardlam CPF includes an ultra-thin ceFLEX™ mechanical shield providing crack prevention capabilities for extended e-ID card lifespan.
Cardlam™ UT
Over 40% thinner, our Ultra-Thin 200 micron polycarbonate inlays with DBond™ technology give document makers more room to compose complex eID card ISO structures and include security features on various inner layers than traditional 350-400 micron counterparts.
Key Features
- Thin – Built with the slimmest and most flexible laminate and module or chip
- Durable – Patented technology and card construction make it exceptionally strong and resistant to everyday wear and tear
- Reliable – Optimum chip performance especially with SOMA™ Chip Operating Systems
- Flexible – Customized layout to match with card manufacturers requirements
- Compliant – Exceeds relevant ISO and ICAO standards
- HID® Skylam™
Cardlam™ CPF
Cardlam CPF includes an ultra-thin ceFLEX™ mechanical shield providing crack prevention capabilities for extended e-ID card lifespan.Cardlam™ UT
Over 40% thinner, our Ultra-Thin 200 micron polycarbonate inlays with DBond™ technology give document makers more room to compose complex eID card ISO structures and include security features on various inner layers than traditional 350-400 micron counterparts.Key Features
- Thin – Built with the slimmest and most flexible laminate and module or chip
- Durable – Patented technology and card construction make it exceptionally strong and resistant to everyday wear and tear
- Reliable – Optimum chip performance especially with SOMA™ Chip Operating Systems
- Flexible – Customized layout to match with card manufacturers requirements
- Compliant – Exceeds relevant ISO and ICAO standards